LGE3556C

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

 

Lead-free/No Pb BGA chips:

245℃-260℃(Maximun)

Leaded/Pb BGA chips:

180℃-205℃(Maximun)